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RD33FG
RD33FG
Rectifier Diode Target Information
Replaces November 2000, version DS5415-1.1 DS5415-2.0 October 2001
FEATURES
s s s
KEY PARAMETERS VRRM IF(AV) IFSM (max) (max) 600V 3997A 46750A
Optimised For High Current Rectifiers High Surge Capability Very Low On-state Voltage
APPLICATIONS
s s s
Electroplating Power Supplies Welding
VOLTAGE RATINGS
Part and Ordering Repetitive Peak Number Reverse Voltage VRRM V RD33FG06 RD33FG05 RD33FG04 RD33FG03 RD33FG02 RD33FG01 600 500 400 300 200 100 Conditions
VRSM = VRRM Outline type code: G (See Package Details for further information) Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in the Voltage Ratings selection table. For example: RD33FG03 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order.
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RD33FG
CURRENT RATINGS
Tcase = 75oC unless otherwise stated Symbol Double Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 3997 6278 6358 A A A Parameter Conditions Max. Units
Single Side Cooled (Anode side) IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 2831 4447 4401 A A A
Tcase = 85C unless otherwise stated Symbol Double Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 3830 6010 6080 A A A Parameter Test Conditions Max. Units
Single Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 2710 4260 4210 A A A
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RD33FG
SURGE RATINGS
Symbol IFSM I2t IFSM I2t Parameter Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current I2t for fusing Test Conditions 10ms half sine, Tcase = 175C VR = 50% VRRM - 1/4 sine 10ms half sine, Tcase = 175C VR = 0 Max. 37.4 7.0 x 106 46.75 10.93 x 106 Units kA A2s kA A2s
THERMAL AND MECHANICAL RATINGS
Symbol Rth(j-c) Parameter Thermal resistance - junction to case Test Conditions Double side cooled Single side cooled DC Anode DC Cathode DC Rth(c-h) Thermal resistance - case to heatsink Clamping force 12.0kN Double side Min. -55 10.8 Max. 0.032 0.064 0.064 0.008 0.016 225 200 200 13.2 Units CW CW CW CW CW C C C kN
(with mounting compound) Single side Tvj Virtual junction temperature Forward (conducting) Reverse (blocking) Tstg Fm Storage temperature range Clamping force
CHARACTERISTICS
Symbol IRM Irr QS VTO rT Parameter Peak reverse current Peak reverse recovery current Total stored charge Threshold voltage Slope resistance Test Conditions At VRRM, Tcase = 200C IF = 1000A, dIRR/dt = 3A/s, Tcase = 200C, VR = 100V At Tvj = 200C At Tvj = 200C Min. Max. 50 30 160 0.6 0.0872 Units mA A C V m
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RD33FG
CURVES
3000 Tj = 200C 2500
Instantaneous forward current, IF - (A)
Mean power dissipation - (W)
4000 dc 1/2 wave 3 phase 6 phase 3000
2000
1500
2000
1000
1000
500
0 0.5
0
0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9
0
500
Instantaneous forward voltage, VF - (V)
1000 1500 2000 2500 3000 Mean forward current, IF(AV) - (A)
3500
4000
Fig. 2 Maximum (limit) forward characteristics
Fig. 3 Power dissipation
1000 IF QS Max. QS
1000
Reverse recovery current IRR - (A)
Stored charge QS - (C)
dI/dt IRM 100 100
Max. IRR Conditions: Tj = 200C VR = 100V IF = 2000A 10 0.1 1.0 10 10 100
Rate of decay of forward current, dIF/dt - (A/s)
Fig. 4 Maximum stored charge and reverse recovery current vs dI/dt
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RD33FG
80 I2t = I2 x t 70
Peak half sine forward current - (kA)
8 7 6
I2t value - (A2s x 106)
Thermal Impedance - Junction to case (C/W)
0.1 Anode side cooled
2
60 50 40 30 20
Double side cooled
5 4 3 2
0.01
I2t
10 1 ms 10 1 235 10 20 Cycles at 50Hz Duration
1 50
0.001 0.001
Conduction Effective thermal resistance Junction to case C/W Double side Anode side 0.032 0.064 d.c. 0.034 0.066 Halfwave 0.044 0.076 3 phase 120 0.057 0.089 6 phase 60 0.01 0.1 Time - (s) 1.0 10
Fig. 5 Surge (non-repetitive) forward current vs time (with 50% VRRM @ Tcase = 175C)
Fig. 6 Maximum (limit) transient thermal impedance
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RD33FG
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
Hole O3.6 x 2.0 deep (in both electrodes)
Cathode O58.5 max O34 nom
O34 nom
Anode
Nominal weight: 250g Clamping force: 12kN 10% Package outine type code: G Note: 1. Package maybe supplied with pins and/or tags.
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RD33FG
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer Services.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS5415-2 Issue No. 2.0 October 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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